SMT + DIP + conformal coating + functional testing — one-stop delivery from prototypes to volume, with full material kits or consigned parts.
Send Gerber, BOM, placement files or an archive. Our engineers review the process and reply with assembly advice and pricing.
Send Gerber, BOM, pick & place files and process requirements by phone, WeChat or email.
DFM review and quotation returned within 2 hours, with process questions answered in parallel.
Order upon quote confirmation; production schedule shared with live progress updates.
Full SMT / DIP / test flow, shipped with inspection reports and lot records.
The more complete the data, the faster the review and the more accurate the quote.
Costs broken down line by line, so you can compare and plan budgets.
| Item | Capability | Notes |
|---|---|---|
| Placement precision | 0201 and 01005 packages | High-precision pick-and-place for fine-pitch devices |
| Package types | BGA, QFN, CSP, QFP, SOP | Including ball-grid and fine-pitch packages |
| Board size | Min 50×50mm, max 400×400mm | Larger sizes assessed individually |
| Layers | Single / double / multilayer (up to 12 layers) | Multilayer boards assessed per process needs |
| Through-hole | Wave soldering, selective soldering, hand soldering | DIP devices and connectors |
| Soldering | Lead-free process, RoHS compliant | Customer standards accommodated |
| Conformal coating | Spray / brush, optional localized protection | Recommended for industrial and outdoor use |
| Inspection | AOI, X-Ray, ICT, FCT, visual | Combined per board type and requirements |
| Packaging | ESD bags, trays, custom labels | White-label and split-carton supported |
The table shows standard capabilities. Special processes (mixed assembly, flex boards, potting, etc.) — please send details for individual review.
Materials verified for model, lot, quantity and appearance; solder paste and critical parts sampled to standard.
First-article inspection before volume run locks process parameters and quality standards.
Automated optical inspection after placement — missing parts, offsets, cold joints and bridges.
Hidden joints on BGA, QFN etc. checked for solder quality and void rates.
DIP insertion, wave or selective soldering followed by re-inspection of through-hole joints.
ICT / FCT functional testing, burn-in sampling and final visual inspection before packing.
Reference lead times for standard boards; actual schedules per the production plan after engineering review. Rush scheduling available.

You supply the key parts — we run the whole process with transparent per-step pricing.

BOM sourcing + PCBA assembly in a single order — simple and worry-free.

From design to finished goods — you receive sellable products.